Advanced packaging & HBM · layer 1

Your capacity order,
checked against the reality of advanced packaging.

Vig IA (Vigía)™ connects your own team's order book — wafer starts, CoWoS bookings, HBM contracts — against real foundry and OSAT capacity, and flags it before the delay reaches production.

The problem

An AI chip's supply chain crosses a dozen countries. It's run on spreadsheets.

Advanced packaging — not silicon — is the real constraint today. Procurement teams can see their direct supplier and little else.

~1,400
process steps crossing a dozen countries to produce one finished AI chip.[1]
52–78
weeks of lead time reported on TSMC's advanced packaging (CoWoS) lines, booked solid through 2027.[2]
2 of 3
tiers of the chain invisible to most procurement teams — visibility stops at the direct supplier.[1]

[1] Y Combinator, Requests for Startups — "Supply Chain 2.0 for Semiconductors," Diana Hu (Summer 2026). ycombinator.com/rfs

[2] Silicon Analysts, "TSMC Foundry Allocation 2026" — CoWoS allocation tracker (updated Jun. 2026). siliconanalysts.com

How it works

A simple loop, running on your own orders.

No generic market dashboards. Vig IA (Vigía)™ is private to your account from the first data you upload.

01

Connect your order book

Upload your wafer starts, packaging bookings, and HBM contracts. Start with CSV; direct ERP integration comes in the next layer.

02

We check it against real capacity

Your order is compared against actively monitored capacity windows and lead times for CoWoS-S/L, HBM3E/HBM4, and foundry nodes.

03

You get your exposure

A clear report: what percentage of your order is at risk, and how much extra lead time to expect.

04

We suggest an alternate route

When your primary provider is saturated, we show you available capacity on alternate routes — another OSAT, another packaging technology.

Who it's for

Teams that manage capacity, not analysts who model it.

Fabless AI chip teams

Startups and second-tier designers competing for CoWoS and HBM space without the negotiating leverage of the biggest buyers.

New CHIPS Act fabs

Operations in Arizona, Texas, Ohio, and New York building their supply chain from scratch, with no reference tool yet.

OSATs and packaging providers

Teams that need to give their own available capacity visibility to the customers looking for it right now.

Pilot — Layer 1

Join the pilot access list.

We're opening a limited number of spots for teams managing real advanced packaging or HBM orders. We'll reach out directly to coordinate integrating your first order.