Advanced packaging & HBM · layer 1

Your capacity order,
checked against the reality of advanced packaging.

Vig-IA (Vigía)™ connects your own team's order book — CoWoS bookings and HBM contracts — against published advanced-packaging and HBM capacity estimates, and flags it before the delay reaches production.

The problem

An AI chip's supply chain crosses a dozen countries. It's run on spreadsheets.

Advanced packaging — not silicon — is the real constraint today. Procurement teams can see their direct supplier and little else.

~1,400
process steps crossing a dozen countries to produce one finished AI chip.[1]
52–78
weeks of lead time reported on TSMC's advanced packaging (CoWoS) lines, booked solid through 2027.[2]
2 of 3
tiers of the chain invisible to most procurement teams — visibility stops at the direct supplier.[1]

[1] Y Combinator, Requests for Startups — "Supply Chain 2.0 for Semiconductors," Diana Hu (Summer 2026). ycombinator.com/rfs

[2] Silicon Analysts, "TSMC Foundry Allocation 2026" — CoWoS allocation tracker (updated Jun. 2026). siliconanalysts.com

How it works

A simple loop, running on your own orders.

No generic market dashboards. Vig-IA (Vigía)™ is private to your account from the first data you upload.

01

Connect your order book

Upload your packaging bookings and HBM contracts with your order dates and supplier-confirmed dates. Start with CSV; direct ERP integration comes in the next layer.

02

We check it against market capacity data

Your order is compared against published capacity estimates and lead times for CoWoS and HBM, each with its source and date.

03

You get your exposure

A clear report: what share of your order your supplier has not confirmed, and how many weeks of delay to expect.

04

Alternate routes, coming next

When your primary provider is saturated, we will show open capacity on alternate routes, published by the suppliers themselves with source and date.

Who it's for

Teams that manage capacity, not analysts who model it.

Fabless AI chip teams

Startups and second-tier designers competing for CoWoS and HBM space without the negotiating leverage of the biggest buyers.

New CHIPS Act fabs

Operations in Arizona, Texas, Ohio, and New York building their supply chain from scratch, with no reference tool yet.

OSATs and packaging providers

Teams that need to give their own available capacity visibility to the customers looking for it right now.

Plans

Pick the depth your team needs.

Tres planes, adaptados a cómo tu equipo compra capacidad. Los precios y características que se muestran son la estructura prevista; los equipos piloto se incorporan directamente.

Starter
$750/month

Small fabless startups.

  • Market dashboard
  • Limited tracking of your own order book
  • Self-serve
Request Starter access
Enterprise
LET'S TALK

CHIPS Act fabs and large OSATs.

  • API and ERP integration
  • Multi-tier mapping
  • Dedicated success manager
  • White-label
Yes, let's talk

Add-on: Enterprise includes 10,000 allocation queries per month. Each additional allocation query beyond it is billed at $0.50–$2.00, so the base price stays predictable. API access applies to Enterprise customers with an active integration.

Pilot — Layer 1

Join the pilot access list.

We're opening a limited number of spots for teams managing real advanced packaging or HBM orders. We'll reach out directly to coordinate integrating your first order.